View 2N2221A2_64483.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com
NPN SILICON SWITCHING TRANSISTOR
Qualified per MIL-PRF-19500/255
DEVICES
LEVELS
2N2221A 2N2221AL 2N2221AUA 2N2221AUB 2N2221AUBC * * Available to JANS quality level only.
2N2222A 2N2222AL 2N2222AUA 2N2222AUB 2N2222AUBC *
JAN JANTX JANTXV JANS
ABSOLUTE MAXIMUM RATINGS (TC = +25C unless otherwise noted) Parameters / Test Conditions
Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current Total Power Dissipation @ TA = +25C Operating & Storage Junction Temperature Range
Symbol
VCEO VCBO VEBO IC PT Top, Tstg
Value
50 75 6.0 800 0.5 -65 to +200
Unit
Vdc Vdc Vdc mAdc W C
TO-18 (TO-206AA)
2N2221A, 2N2222A
THERMAL CHARACTERISTICS
Parameters / Test Conditions Symbol Max. 325 210 325 Unit C/W
Thermal Resistance, Junction-to-Ambient 2N2221A, L 2N2222A, L RJA 2N2221AUA 2N2222AUA 2N2221AUB, UBC 2N2222AUB, UBC Note: Consult 19500/255 for thermal performance curves. 1. Derate linearly 3.08mW/C above TA > +37.5C
4 PIN
2N2221AUA, 2N2222AUA
2.
Derate linearly 4.76mW/C above TA > +63.5C
ELECTRICAL CHARACTERISTICS (TA = +25C, unless otherwise noted) Parameters / Test Conditions
OFF CHARACTERTICS Collector-Emitter Breakdown Voltage IC = 10mAdc Collector-Base Cutoff Current VCB = 75Vdc VCB = 60Vdc Emitter-Base Cutoff Current VEB = 6.0Vdc VEB = 4.0Vdc Collector-Emitter Cutoff Current VCE = 50Vdc T4-LDS-0060 Rev. 2 (100247) V(BR)CEO ICBO 50 10 10 10 10 50 Vdc Adc Adc Adc Adc Adc
Symbol
Min.
Max.
Unit
3 PIN
2N2221AUB, 2N2222AUB 2N2221AUBC, 2N2222AUBC (UBC = Ceramic Lid Version)
IEBO ICES
Page 1 of 6
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com
ELECTRICAL CHARACTERISTICS (TA = +25C, unless otherwise noted)
Parameters / Test Conditions ON CHARACTERISTICS
(2)
Symbol
Min.
Max.
Unit
Forward-Current Transfer Ratio IC = 0.1mAdc, VCE = 10Vdc
2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC VCE(sat) hFE
30 50 35 75 40 100 40 100 20 30 0.3 1.0 0.6 1.2 2.0 Max. Vdc 120 300 150 325
IC = 1.0mAdc, VCE = 10Vdc
IC = 10mAdc, VCE = 10Vdc
IC = 150mAdc, VCE = 10Vdc
IC = 500mAdc, VCE = 10Vdc Collector-Emitter Saturation Voltage IC = 150mAdc, IB = 15mAdc IC = 500mAdc, IB = 50mAdc Base-Emitter Voltage IC = 150mAdc, IB = 15mAdc IC = 500mAdc, IB = 50mAdc
VBE(sat)
Vdc
DYNAMIC CHARACTERISTICS
Parameters / Test Conditions Small-Signal Short-Circuit Forward Current Transfer Ratio IC = 1.0mAdc, VCE = 10Vdc, f = 1.0kHz 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC Magnitude of Small-Signal Short-Circuit Forward Current Transfer Ratio IC = 20mAdc, VCE = 20Vdc, f = 100MHz Output Capacitance VCB = 10Vdc, IE = 0, 100kHz f 1.0MHz Input Capacitance VEB = 0.5Vdc, IC = 0, 100kHz f 1.0MHz Cibo 25 pF Cobo 8.0 pF Symbol hfe Min. 30 50 Unit
|hfe|
2.5
SWITCHING CHARACTERISTICS
Parameters / Test Conditions Turn-On Time See figure 8 of MIL-PRF-19500/255 Turn-Off Time See Figure 9 of MIL-PRF-19500/255 (2) Pulse Test: Pulse Width = 300s, Duty Cycle 2.0%. Symbol ton toff Min. Max. 35 300 Unit s s
T4-LDS-0060 Rev. 2 (100247)
Page 2 of 6
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com
PACKAGE DIMENSIONS
NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Beyond r (radius) maximum, TL shall be held for a minimum length of .011 inch (0.28 mm). 4. Dimension TL measured from maximum HD. 5. Body contour optional within zone defined by HD, CD, and Q. 6. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within .007 inch (0.18 mm) radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC. 7. Dimension LU applies between L1 and L2. Dimension LD applies between L2 and LL minimum. Diameter is uncontrolled in L1 and beyond LL minimum. 8. All three leads. 9. The collector shall be internally connected to the case. 10. Dimension r (radius) applies to both inside corners of tab. 11. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. 12. Lead 1 = emitter, lead 2 = base, lead 3 = collector. 13. For L suffix devices, dimension LL = 1.5 inches (38.10 mm) min. and 1.75 inches (44.45 mm) max.
Symbol CD CH HD LC LD LL LU L1 L2 P Q TL TW r
Dimensions Inches Millimeters Min Max Min Max .178 .195 4.52 4.95 .170 .210 4.32 5.33 .209 .230 5.31 5.84 .100 TP 2.54 TP .016 .021 0.41 0.53 .500 .750 12.70 19.05 .016 .019 0.41 0.48 .050 1.27 .250 6.35 .100 2.54 .030 0.76 .028 .048 0.71 1.22 .036 .046 0.91 1.17 .010 0.25 45 TP 45 TP 1, 2, 9, 11, 12, 13
Note
6 7,8 7,8,13 7,8 7,8 7,8 5 3,4 3 10 6
FIGURE 1. Physical dimensions (similar to TO-18).
T4-LDS-0060 Rev. 2 (100247) Page 3 of 6
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com
NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Dimension CH controls the overall package thickness. When a window lid is used, dimension CH must increase by a minimum of .010 inch (0.254 mm) and a maximum of .040 inch (1.020 mm). 4. The corner shape (square, notch, radius) may vary at the manufacturer's option, from that shown on the drawing. 5. Dimensions LW2 minimum and L3 minimum and the appropriate castellation length define an unobstructed three-dimensional space traversing all of the ceramic layers in which a castellation was designed. (Castellations are required on the bottom two layers, optional on the top ceramic layer.) Dimension LW2 maximum and L3 maximum define the maximum width and depth of the castellation at any point on its surface. Measurement of these dimensions may be made prior to solder dipping. 6. The co-planarity deviation of all terminal contact points, as defined by the device seating plane, shall not exceed .006 inch (0.15mm) for solder dipped leadless chip carriers. 7. In accordance with ASME Y14.5M, diameters are equivalent to x symbology.
Symbol BL BL2 BW BW2 CH L3 LH LL1 LL2 LS LW LW2
Dimensions Inches Millimeters Min Max Min Max .215 .225 5.46 5.71 .225 5.71 .145 .155 3.68 3.93 .155 3.93 .061 .075 1.55 1.90 .003 .007 0.08 0.18 .029 .042 0.74 1.07 .032 .048 0.81 1.22 .072 .088 1.83 2.23 .045 .055 1.14 1.39 .022 .028 0.56 0.71 .006 .022 0.15 0.56
Note
3 5
5
Pin no. Transistor
1 Collector
2 Emitter
3 Base
4 N/C
FIGURE 2. Physical dimensions, surface mount (UA version).
T4-LDS-0060 Rev. 2 (100247)
Page 4 of 6
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com
UB
Symbol BH BL BW CL CW LL1 LL2
Dimensions Inches Millimeters Min Max Min Max .046 .056 1.17 1.42 .115 .128 2.92 3.25 .085 .108 2.16 2.74 .128 3.25 .108 2.74 .022 .038 0.56 0.96 .017 .035 0.43 0.89
Note
Symbol LS1 LS2 LW r r1 r2
Dimensions Inches Millimeters Min Max Min Max .036 .040 0.91 1.02 .071 .079 1.81 2.01 .016 .024 0.41 0.61 .008 .203 .012 .305 .022 .559
Note
NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Hatched areas on package denote metalized areas. 4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Shielding connected to the lid. 5. In accordance with ASME Y14.5M, diameters are equivalent to x symbology.
FIGURE 3. Physical dimensions, surface mount (UB version)
T4-LDS-0060 Rev. 2 (100247)
Page 5 of 6
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com
UBC
Symbol BH BL BW CL CW LL1 LL2
Dimensions Inches Millimeters Min Max Min Max .046 .071 1.17 1.80 .115 .128 2.92 3.25 .085 .108 2.16 2.74 .128 3.25 .108 2.74 .022 .038 0.56 0.96 .017 .035 0.43 0.89
Note
Symbol LS1 LS2 LW r r1 r2
Dimensions Inches Millimeters Min Max Min Max .036 .040 0.91 1.02 .071 .079 1.81 2.01 .016 .024 0.41 0.61 .008 .203 .012 .305 .022 .559
Note
NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Hatched areas on package denote metalized areas. 4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Connected to the lid braze ring. 5. In accordance with ASME Y14.5M, diameters are equivalent to x symbology.
FIGURE 4. Physical dimensions, surface mount (UBC version, ceramic lid)
T4-LDS-0060 Rev. 2 (100247)
Page 6 of 6

▲Up To Search▲

Price & Availability of 2N2221A2

	To Download 2N2221A2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .